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NTHD4502N
PACKAGE DIMENSIONS
ChipFET ]
CASE 1206A ? 03
ISSUE K
H E
8
1
7
2
D
6
3
5
4
E
q
L
5
4
6
3
7
2
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL
AND VERTICAL SHALL NOT EXCEED 0.08 MM.
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD
SURFACE.
MILLIMETERS
INCHES
e1
e
b
A
c
0.05 (0.002)
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
SOURCE 1
GATE 1
SOURCE 2
GATE 2
DRAIN 2
DRAIN 2
DRAIN 1
DRAIN 1
DIM
A
b
c
D
E
e
e1
L
H E
q
MIN NOM MAX
1.00 1.05 1.10
0.25 0.30 0.35
0.10 0.15 0.20
2.95 3.05 3.10
1.55 1.65 1.70
0.65 BSC
0.55 BSC
0.28 0.35 0.42
1.80 1.90 2.00
5 ° NOM
MIN
0.039
0.010
0.004
0.116
0.061
0.011
0.071
NOM
0.041
0.012
0.006
0.120
0.065
0.025 BSC
0.022 BSC
0.014
0.075
5 ° NOM
MAX
0.043
0.014
0.008
0.122
0.067
0.017
0.079
SOLDERING FOOTPRINT
2.03 2
2 .36 2
0.093
1
0.08
8X
0.65
0.025
PITCH
8X
0 .45 7
0.018
0.66
0.026
mm
inches
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NTHD4502N/D
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